Made with a low-shrinkage PI (polyimide) substrate, coated with heat-resistant polyurethane or silicone adhesive. Suitable for semiconductor packaging or electronic component encapsula-tion, effectively preventing resin leakage.
Made with a low-shrinkage PI (polyimide) substrate, coated with heat-resistant polyurethane or silicone adhesive. Suitable for semiconductor packaging or electronic component encapsula-tion, effectively preventing resin leakage.
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